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A robust method of enhancement of protection ability of electrodeposited silane film over copper surface using H 2 O 2
Author(s) -
Karthik N.,
Sethuraman M. G.
Publication year - 2014
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.201307396
Subject(s) - copper , dielectric spectroscopy , raman spectroscopy , materials science , metal , electrochemistry , silane , spectroscopy , polarization (electrochemistry) , nuclear chemistry , inorganic chemistry , analytical chemistry (journal) , chemistry , metallurgy , electrode , composite material , organic chemistry , physics , quantum mechanics , optics
The enhancement of protection of copper through pretreatment of metal surface with H 2 O 2 and subsequent addition of H 2 O 2 in the electrodeposition of 3‐mercaptopropyltrimethoxysilane (MPTS) has been investigated in the present work. MPTS films over copper surface with and without H 2 O 2 were investigated by FT‐IR, XRD, Raman spectroscopy and SEM. The protection of copper surface by MPTS in the presence and absence of H 2 O 2 in 1% NaCl medium was also investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization studies (PDS). The results of the study indicate that MPTS film electrodeposited on pretreated copper with 1000 ppm of H 2 O 2 increases the inhibition efficiency to almost 100%.