Premium
Influence of dual‐RRA temper on the exfoliation corrosion and electrochemical behavior of Al–Zn–Mg–Cu alloy
Author(s) -
Peng G.S.,
Chen K.H.,
Chen S.Y.,
Fang H.C.
Publication year - 2013
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.201106234
Subject(s) - corrosion , materials science , alloy , exfoliation joint , transmission electron microscopy , ultimate tensile strength , scanning electron microscope , metallurgy , polarization (electrochemistry) , electrochemistry , grain boundary , dielectric spectroscopy , analytical chemistry (journal) , composite material , chemistry , microstructure , electrode , chromatography , nanotechnology , graphene
Influence of dual‐retrogression and reaging (dual‐RRA) temper on the exfoliation corrosion (EC) and electrochemical behavior of Al–Zn–Mg–Cu alloy has been investigated by means of transmission electron microscope, energy dispersive X‐ray spectroscopy, tensile test, polarization curve, and EIS. Dual‐RRA temper not only kept the strength similar to retrogression and reaging temper, but also improved EC resistance compared to T76 temper, being attributed to coarser and sparser grain boundary precipitates as well as higher Cu and lower Zn content. Obtained polarization curves and EIS are in good agreement with EC rating sequence.