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In‐situ investigation of the surface‐topography during anodic dissolution of copper under near‐ECM conditions
Author(s) -
Schneider M.,
Schroth S.,
Schubert N.,
Michaelis A.
Publication year - 2012
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.201005716
Subject(s) - anode , dissolution , cathode , electrolyte , materials science , electrochemistry , copper , electrode , electrochemical machining , volumetric flow rate , electrochemical cell , analytical chemistry (journal) , metallurgy , chemical engineering , chemistry , physics , chromatography , engineering , quantum mechanics
Electrochemical machining is characterized by deliberate high speed anodic dissolution. The distance between anode and cathode are only a few hundred microns. Additionally, the electrolyte flow rate is in the range of approximately meter/second. A special electrochemical cell design was developed to investigate the surface topography during the anodic dissolution simultaneously and in‐situ under near‐ECM conditions. The anode was directly placed under the cathode with a gap of 350 µm. We carried out pulse experiments at 15 A/cm 2 and 25 A/cm 2 with an electrolyte flow rate of 4m/s. First‐time it was possible to observe the surface changing of the anode directly during current pulses by using a video camera. Different stages e.g. roughening, film formation or gas evolution could be distinguished.