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Structure of corrosion film formed on copper exposed to controlled corrosive environment
Author(s) -
Reid M.,
Tanner D. A.,
Belochapkine S.,
Garfias L. F.
Publication year - 2009
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.200805084
Subject(s) - chalcocite , cuprite , copper , corrosion , materials science , transmission electron microscopy , metallurgy , oxide , layer (electronics) , focused ion beam , penetration (warfare) , chemical engineering , composite material , ion , nanotechnology , chemistry , chalcopyrite , organic chemistry , operations research , engineering
This paper describes a transmission electron microscopy (TEM) investigation of copper coupons exposed to a corrosive mixed flowing gas environment (MFG). A focused ion beam (FIB) lift‐out technique was used to extract electron transparent specimens for TEM investigation. A duplex corrosion film comprising cuprite (Cu 2 O) and chalcocite (Cu 2 S) developed on the copper substrate. The oxide demonstrated a dense morphology with evidence of chlorine in the oxide layer showing that chlorine plays an important role in the corrosion of copper transforming the protective Cu 2 O layer to a non‐protective layer. The outer layer of the Cu 2 S demonstrated a porous morphology allowing easy penetration of water and gases.