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Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders
Author(s) -
Montesperelli G.,
Rapone M.,
Nanni F.,
Travaglia P.,
Riani P.,
Marazza R.,
Gusmano G.
Publication year - 2008
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.200804098
Subject(s) - intermetallic , corrosion , materials science , alloy , dielectric spectroscopy , metallurgy , microstructure , tin , soldering , ultimate tensile strength , tensile testing , polarization (electrochemistry) , electrochemistry , electrode , chemistry
In this paper, two tin‐based alloys (Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn) are proposed as new lead‐free solders. Alloys have been developed by melting pure elements. Samples have been evaluated in terms of microstructure, corrosion resistance and mechanical features. Corrosion tests have been performed in 3% NaCl solution by polarization curves and electrochemical impedance spectroscopy (EIS). SEM observations and EDS analysis were carried out on samples before and after corrosion tests. Static monotonic tensile tests have been performed on three specimens for each alloy. SEM and EDS analysis revealed the presence of Sn‐Ag and Sn‐Cu intermetallic compounds within the Sn‐Ag‐Cu alloy. As a result of corrosion test, the Sn‐Ag‐Cu alloy showed a better corrosion resistance with respect to Sn‐Bi‐Zn. Both alloys evidenced good mechanical properties higher than the traditional Sn‐Pb system. Sn‐Ag‐Cu seems to be a suitable soldering material.