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Study of two new aqueous alkaline Copper cleaning solutions and comparison with a conventional bath
Author(s) -
Otero E.,
Bastidas J. M.
Publication year - 1996
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.19960470906
Subject(s) - resorcinol , copper , aqueous solution , polarization (electrochemistry) , corrosion , inorganic chemistry , chemistry , electrochemistry , formaldehyde , gravimetric analysis , phloroglucinol , materials science , nuclear chemistry , metallurgy , electrode , organic chemistry
This paper studies the cleaning of commercial copper with two new aqueous alkaline solutions containing formaldehyde and D(+)glucose at room temperature. The results are compared with a conventional cleaning solution. Three organic corrosion inhibitors were used: Phloroglucinol, 8‐Quinolinol and Resorcinol. Rest potential, polarization resistance and polarization curves were the electrochemical techniques used. The gravimetric technique was also used. It has been observed that the two new cleaning solutions remove copper tarnishing. The solution with D(+)glucose produces the best surface finish. Likewise, the conventional solution is an excellent copper cleaning bath. The order of inhibition efficiency of the organic inhibitors is as follows: 8‐Quinolinol > Phloroglucionol > Resorcinol.