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Characterisation of reaction layers on copper surfaces formed in aqueous chloride and sulphate ion containing electrolytes
Author(s) -
Siedlarek H.,
Füßinger B.,
Hänßel I.,
Fischer W. R.
Publication year - 1994
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.19940451205
Subject(s) - copper , chloride , electrolyte , oxide , inorganic chemistry , dissolution , aqueous solution , corrosion , chemistry , erosion corrosion of copper water tubes , pitting corrosion , electrochemistry , metal , materials science , electrode , organic chemistry
Copper is in a passive state in a potential range of 50 mV H to about 300 mV H in contact with an aqueous electrolyte at neutral pH caused by the formation of a thin tarnishing layer consisting of copper(I)‐corrosion products. This layer inhibits more the anodic than the cathodic partial reaction of the corrosion process. The steep threshold in the transpassive range leads to the oxidation of copper and the formation of secondarily formed reaction layers. In sulphate containing electrolytes voluminous reaction layers of crystalline non‐protective copper(I)‐oxide are formed. The manifestation of corrosion is general attack. In chloride containing electrolytes a two‐fold reaction layer is formed, copper(I)‐chloride underneath copper(I)‐oxide. This amorphous copper(I)‐oxide is formed via hydrolysis of copper(I)‐chloride and inhibits anodic metal dissolution. The only observed manifestation of corrosion is repassivating pitting.