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Inhibition of localized attack on the aluminium alloy AA 6351 in glycol/water solutions
Author(s) -
Monticelli C.,
Brunoro G.,
Zucchi F.,
Fagioli F.
Publication year - 1989
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.19890400607
Subject(s) - tungstate , sodium tungstate , copper , alloy , electrochemistry , inorganic chemistry , aluminium , boiling , sodium molybdate , chemistry , electrolyte , molybdate , materials science , metallurgy , tungsten , organic chemistry , electrode
A previous study had shown that exposure to degraded propylene glycol(PG)/water solution (1:1 in volume) at 80°C for 60 days or to boiling PG/water solution for 30 days induce remarkable localized attack on aluminium alloy AA 6351 (nominal composition: 1% Si, 0.6% Mg, 0.3% Mn, balance Al). In the present work degradation of the solution was achieved by holding the PG/water solution at its boiling temperature for 30 days in contact with AA 6351. The observed localized attack was mainly attributed to the action of copper ions dissolved from the aluminium alloy (copper content = 0.07%) and then deposited as small spots acting as efficient cathodic areas. The objective of this work was to examine the feasibility of enhancing pitting resistance of AA 6351 by adding suitable inhibitors to the solutions. The compounds used were two inorganic salts: sodium molybdate and sodium tungstate and two derivatives of pyrimidine: 2‐aminopyrimidine (2AP) and 2‐hydroxypyrimidine (2HP). The inhibiting efficiencies of these substances were tested by both short‐time electrochemical tests (galvanic coupling tests and polarization curves) and long‐time immersions under experimental conditions causing the localized attack. Molybdate, tungstate and, to some extent, also 2AP efficiently inhibit AA 6351 localized corrosion in degraded solutions at 80°C and in pure boiling solutions, for long exposure periods. The short‐time electrochemical tests suggest that molybdate and tungstate are able to retard the electrochemical processes occurring on both the aluminium alloy and the small copper cathodic area produced by copper deposition. On the other hand, the 2AP efficiency is attributed to some complexing capability of this pyrimidine derivative towards dissolved copper ions, that are stabilized in solution. 2HP does not prevent AA 6351 localized attack.