Premium
Copper corrosion in sulphuric acid at heat transfer
Author(s) -
Bartoníček Robert
Publication year - 1979
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/maco.19790300307
Subject(s) - grashof number , copper , corrosion , heat transfer , chemistry , natural convection , sherwood number , metal , thermodynamics , electrode , film temperature , analytical chemistry (journal) , materials science , metallurgy , nusselt number , chromatography , physics , reynolds number , turbulence
Under the conditions of the spontaneous convection from the upper horizontal surface of disk‐type copper electrodes the copper corrosion rate in a solution of 1 N H 2 SO 4 +0.001 M K 2 Cr 2 O 7 was measured. The effects of the surface temperature of the corroding metal and the effect of the temperature difference between the surface and the solution were determined. The accelerating effect of the heat transfer is attributed to the additional free flow induced by the temperature gradient. Results can be correlated by the equation Sh = 0.163 (Sc · GR h ) 0.33 , where Sh is the Sherwood number expressing the corrosion rate at the heat transfer, GR h is the combined Grashof number for the pressure effect of concentration and temperature, and Sc is the Schmidt number.