Open AccessLaser + Camera = Innovation
Author(s) -
Lehmann Wolfgang
Publication year - 2017
Publication title -
laser technik journal
Language(s) - English
Resource type - Journals
eISSN - 1863-9119
pISSN - 1613-7728
DOI - 10.1002/latj.201790006
Subject(s) - wafer , laser , drill , welding , materials science , printed circuit board , chip , semiconductor , computer science , mechanical engineering , optoelectronics , optics , composite material , telecommunications , engineering , metallurgy , physics , operating system
The use of modern laser technology has become standard in industrial manufacturing thanks to its speed, accuracy and effectiveness. Lasers are used to engrave parts, electronic printed circuit boards or chip cards. They perforate packaging, structure semiconductor wafers, drill, cut and weld plastics or metals, and create highly complex structures via 3D printing — all contactless, with no application of force and wear‐free.