Open AccessClosing the Gap between Electronics and High Power Connectors: LIMBO
Author(s) -
Britten Simon W.
Publication year - 2016
Publication title -
laser technik journal
Language(s) - English
Resource type - Journals
eISSN - 1863-9119
pISSN - 1613-7728
DOI - 10.1002/latj.201600012
Subject(s) - materials science , welding , electronics , closing (real estate) , copper , impulse (physics) , substrate (aquarium) , voltage , optoelectronics , power electronics , thermal , computer science , electrical engineering , metallurgy , engineering , oceanography , physics , quantum mechanics , geology , meteorology , political science , law
To integrate high power electronic components in conventionally low voltage environments, the joining of massive copper interconnectors on thermally‐sensitive substrates poses a significant key processing step. However, conventional welding approaches deposit an excess of energy in the thermally‐sensitive substrates. The laser impulse metal bonding process (LIMBO) applies a new welding approach in order to join thick copper interconnectors on a metallized substrate with a minimal thermal input into the substrate.