
Micromachining using high‐power picosecond lasers
Author(s) -
Engelhardt Uli,
Hildenhagen Jens,
Dickmann Klaus
Publication year - 2011
Publication title -
laser technik journal
Language(s) - English
Resource type - Journals
eISSN - 1863-9119
pISSN - 1613-7728
DOI - 10.1002/latj.201190056
Subject(s) - surface micromachining , materials science , laser , optoelectronics , picosecond , machining , optics , absorption (acoustics) , femto , composite material , fabrication , computer science , medicine , computer network , physics , alternative medicine , pathology , metallurgy
For the micromachining of temperature‐sensitive and brittle‐rigid components ultra short pulsed lasers are being used more and more. Due to the short pulse durations in the femto‐ and pico second range such systems with only a few Watt of average power have high pulsed peak powers of an order of 10 MW. This allows machining a wide range of materials including transparent materials via non‐linear absorption, enabled by the high intensity in the focus of radiation. The intensity can reach values of several TW/cm 2 . This leads to the immediate evaporation of the material, ideally, without melt and burr.