Open AccessCO 2 Lasers for Flexible Food Packaging
Author(s) -
Dinauer William R.,
Gaebler Frank
Publication year - 2008
Publication title -
laser technik journal
Language(s) - Uncategorized
Resource type - Journals
eISSN - 1863-9119
pISSN - 1613-7728
DOI - 10.1002/latj.200790208
Subject(s) - reliability (semiconductor) , throughput , laser , key (lock) , computer science , process engineering , materials science , telecommunications , optics , computer security , wireless , physics , power (physics) , quantum mechanics , engineering
Abstract Compact size and high reliability are key factors enabling digital converting systems that incorporate multiple lasers for high‐throughput cutting, perforating and scoring of flexible films.