Open AccessLaser Micro Processing of Semiconductors and Dielectrics
Author(s) -
Weiler Sascha
Publication year - 2008
Publication title -
laser technik journal
Language(s) - English
Resource type - Journals
eISSN - 1863-9119
pISSN - 1613-7728
DOI - 10.1002/latj.200790205
Subject(s) - semiconductor , laser , revenue , laser ablation , semiconductor laser theory , semiconductor device fabrication , picosecond , production (economics) , materials processing , semiconductor industry , computer science , materials science , engineering physics , nanotechnology , business , manufacturing engineering , optoelectronics , engineering , optics , economics , physics , finance , wafer , macroeconomics
In 2007 the semiconductor manufacturing industry is expected to make more than $250 billion gross revenue and invest over $40 billion in new equipment. The demand for cheaper and increasingly powerful end products, like PCs, Laptops and MP3 Players is the driving force for further development of production equipment. Barrier breaking picosecond lasers for direct ablation of semiconductors are paving the way for the next generation of such machinery.