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Research on corrosion resistance of metal films sputtered by rotating target and planar target
Author(s) -
Ma Weijie,
Hu Haifeng,
Ding Xianlin,
Chen Qicheng,
Zhang Ming,
Guo Zongjie,
Shao Xibin
Publication year - 2017
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1002/jsid.565
Subject(s) - sputtering , materials science , corrosion , layer (electronics) , composite material , metal , planar , thin film , sputter deposition , metallurgy , nanotechnology , computer science , computer graphics (images)
The corrosion resistance of MoNb/AlNd/MoNb film during different sputter conditions was studied for G6 rotating target sputter equipment. The results show that with the increase of sputter power and the increase of the thickness, top MoNb tends to form coarse columnar crystals, and the corrosion resistance of the metal thin films, at first, increases and then decreases with the increase of sputter power and metal thickness. As the sputter temperature increases, top MoNb tends to form coarse grains while the corrosion resistance of the film is poor. The result also release that with the increase of the target speed, top MoNb film becomes loose so that it is difficult to play a protective role because of its poor corrosion resistance ability. Under the same conditions, the sputter of the planar target film is denser; as a result, the top MoNb layer can protect the inner AlNd layer from corrosion.