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9.4‐inch 228‐ppi flexible micro‐LED display
Author(s) -
Lee SeokLyul,
Cheng ChunCheng,
Liu ChanJui,
Yeh ChengNan,
Lin YuChieh
Publication year - 2021
Publication title -
journal of the society for information display
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.578
H-Index - 52
eISSN - 1938-3657
pISSN - 1071-0922
DOI - 10.1002/jsid.1022
Subject(s) - backplane , led display , thin film transistor , brightness , materials science , flexible display , active matrix , optoelectronics , flat panel display , computer science , display resolution , light emitting diode , interconnection , flip chip , display device , optics , computer hardware , telecommunications , nanotechnology , physics , layer (electronics) , adhesive , operating system
A 9.4‐inch 228‐ppi full‐color micro‐LED display using the flexible low temperature polysilicon thin‐film transistor (LTPS‐TFT) backplane has been successfully developed. In order to solve the interconnection of tiny micro‐LEDs, those size are less than 30 μm, we introduced the flip‐chip soldering technology for high‐resolution flexible micro‐LED displays. Contrast ratio of >1,000,000:1 with a brightness of 700 nits was realized by the full‐color micro‐LED display with uniform brightness and color shift free at any off‐axis viewing angles. These supreme micro‐LED visual performances will provide a more comfortable user experience for high‐resolution flexible automotive applications.