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Fast 3D thermal simulation of power module packaging
Author(s) -
Swan Ian R.,
Bryant Angus T.,
Mawby Philip A.
Publication year - 2012
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.841
Subject(s) - transient (computer programming) , thermal conduction , inverter , computer science , power (physics) , thermal , fourier series , electronic circuit simulation , heat equation , printed circuit board , electronic engineering , electrical engineering , engineering , electronic circuit , physics , thermodynamics , mathematics , mathematical analysis , quantum mechanics , operating system
SUMMARY This paper presents a thermal model that uses a Fourier series solution to the heat equation to carry out transient 3D thermal simulation of power device packaging. The development and implementation of this physics‐based method is described. The method is demonstrated on a stacked 3D multichip module. The required aspects of 3D heat conduction are captured successfully by the model. Compared with previous thermal models presented in literature, it is fast, accurate and can be easily integrated with an inverter circuit simulator to model realistic converter load cycles. Copyright © 2012 John Wiley & Sons, Ltd.