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The method of lines for the analysis of composite‐metal lossy microstrip lines
Author(s) -
Gao Bo,
Tong Ling,
Gong Xun
Publication year - 2010
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.791
Subject(s) - microstrip , lossy compression , composite number , materials science , metal , layer (electronics) , field (mathematics) , composite material , acoustics , electronic engineering , physics , computer science , engineering , mathematics , metallurgy , artificial intelligence , pure mathematics
A full‐wave analysis of the composite‐metal microstrip lines is presented. The effects of the composite metal to the loss of the microstrip lines are accurately investigated, which are often avoided by other methods. The metal layers of the microstrip lines are considered as lossy inhomogeneous layers. The effects of the thickness of the Au layer and Ti layer are given, respectively. And the reasons that lead to the differences between them are discussed for the first time by analyzing the longitudinal electric field on the strip. The results are compared with other published data. Copyright © 2010 John Wiley & Sons, Ltd.