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Taguchi‐numerical approach on thermomechanical reliability for PBGA
Author(s) -
Yang Ping,
Tan Guangbin
Publication year - 2010
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.789
Subject(s) - taguchi methods , ball grid array , temperature cycling , orthogonal array , materials science , reliability (semiconductor) , soldering , printed circuit board , composite material , mechanical engineering , ball (mathematics) , molding (decorative) , thermal , computer science , engineering , mathematics , quantum mechanics , meteorology , mathematical analysis , power (physics) , physics , operating system
Abstract The aim of this article is to provide a systematic numerical experimental method to evaluate the thermomechanical reliability of plastic ball grid array (PBGA) under thermal cycling based on the Taguchi method. An L18(2 1 × 3 7 ) orthogonal array is designed for selecting eight control factors of BGA, which includes Printed Circuit Board) dimensions, substrate dimensions, dimensions of solder joints, the thickness of silicon die and the thickness of encapsulation molding compound. The Taguchi method evaluation shows that the best matching combination of geometry parameters for improving the reliability of solder under thermal cycling. It builds a basis for future work for design and reliability evaluation of PBGA packaging. Copyright © 2010 John Wiley & Sons, Ltd.