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Thermal modelling of the chip for the REMS wind sensor
Author(s) -
Kowalski L.,
Ricart J.,
Jiménez V.,
Domínguez M.,
Castañer L.
Publication year - 2009
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.738
Subject(s) - martian , mars exploration program , chip , aerospace engineering , wind speed , thermal , environmental science , remote sensing , computer science , engineering , mechanical engineering , automotive engineering , marine engineering , electrical engineering , meteorology , astrobiology , geology , physics
The silicon chip designed and fabricated by Micro and Nano Technology Group from Universitat Politècnica de Catalunya, which has been delivered to the Rover Environment Monitoring Station project, is the basic sensing element of the wind sensor included on the meteorological station for the Mars rover. The purpose of this article is to describe a thermal modelling analysis of the sensor under the rarefied Martian environment and to assure the sensor ability for reliable wind speed and incidence angle measurements. Copyright © 2009 John Wiley & Sons, Ltd.