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Full‐wave‐based transmission‐line model for lossy‐substrate multiconductor interconnects
Author(s) -
Kordi Behzad,
Bridges Greg E.,
LoVetri Joe,
Nordstrom John E.
Publication year - 2007
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.660
Subject(s) - transmission line , coplanar waveguide , lossy compression , substrate (aquarium) , conductor , materials science , dielectric , etching (microfabrication) , dispersion (optics) , electronic engineering , line (geometry) , electric power transmission , equivalent circuit , optoelectronics , time domain , acoustics , optics , electrical engineering , computer science , physics , telecommunications , engineering , microwave , voltage , mathematics , composite material , geometry , oceanography , layer (electronics) , artificial intelligence , computer vision , geology
A full‐wave‐based modal analysis is used for simulating a multiconductor coplanar waveguide (CPW) over a selectively etched lossy silicon substrate. Propagating modes, which are similar to the classic ‘common’ and ‘differential’ modes, are extracted, and circuit theory energy relationships are used for the determination of transmission‐line model parameters. A time‐frequency domain technique is employed for implementing the transmission‐line model within a circuit simulator. The model is used to study the effect of etching the dielectric and the substrate for a two‐conductor CPW line. The simulation results show that etching both the dielectric and the lossy substrate improves the loss and dispersion characteristics of the CPW line. Copyright © 2007 John Wiley & Sons, Ltd.