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A novel hybrid electrical/mechanical optimization technique using time‐domain modeling, finite element method and statistical tools for co‐design and optimization of RF‐integrated mechanical structures
Author(s) -
You Chisang,
Staiculescu Daniela,
Martin Lara,
Tentzeris Manos M.
Publication year - 2007
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.654
Subject(s) - finite element method , bandwidth (computing) , electronic engineering , antenna (radio) , microstrip antenna , honeycomb structure , radio frequency , time domain , composite number , mechanical engineering , engineering , computer science , electrical engineering , structural engineering , aerospace engineering , telecommunications , algorithm , computer vision
Abstract The successful use of a design of experiments (DOE) and response surface methods (RSM) approaches in a simultaneous electrical and mechanical optimization study is presented for RF‐integrated mechanical structures. The basic geometry is a mechanically used composite structure consisting of composites facesheets and honeycomb core, in which a microstrip antenna is embedded. The antenna is electromagnetically modeled in time domain and it is found that, for the chosen geometry, the integrated composite structure improves the gain of the antenna without affecting the bandwidth. The structure is then optimized using the same experiment that integrates both the electrical and mechanical parameters of the system. The simple factorial design is very simple to implement and gives a clear understanding of the system behavior, including the interaction between the mechanical changes and electrical performance thus allowing the engineer to integrate, for the first time, both the electrical and mechanical features of the integrated system in the same optimization technique. Copyright © 2007 John Wiley & Sons, Ltd.