High‐frequency simulations and compact models compared with measurements for passive on‐chip components | Zendy

Meuris Peter | Zendy; Ciuprina Gabriela | Zendy; Seebacher Ehrenfried | Zendy

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High‐frequency simulations and compact models compared with measurements for passive on‐chip components

Author(s) -

Meuris Peter,

Ciuprina Gabriela,

Seebacher Ehrenfried

Publication year - 2005

Publication title -

international journal of numerical modelling: electronic networks, devices and fields

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.249

H-Index - 30

eISSN - 1099-1204

pISSN - 0894-3370

DOI - 10.1002/jnm.569

Subject(s) - spice , chip , resistor , capacitor , electronic engineering , electronic component , materials science , electrical engineering , engineering , voltage

Dedicated on‐chip passive test structures to test the quality of high‐frequency simulations and compact models are described. Based upon the simulations a compact (SPICE) model is calculated. The paper shows the quantitative correlation between measurements and simulations for a resistor, a coplanar line and a metal insulator metal capacitor. Agreement of less than 10% is obtained between measurements and simulations. Copyright © 2005 John Wiley & Sons, Ltd.

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