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High‐frequency simulations and compact models compared with measurements for passive on‐chip components
Author(s) -
Meuris Peter,
Ciuprina Gabriela,
Seebacher Ehrenfried
Publication year - 2005
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.569
Subject(s) - spice , chip , resistor , capacitor , electronic engineering , electronic component , materials science , electrical engineering , engineering , voltage
Abstract Dedicated on‐chip passive test structures to test the quality of high‐frequency simulations and compact models are described. Based upon the simulations a compact (SPICE) model is calculated. The paper shows the quantitative correlation between measurements and simulations for a resistor, a coplanar line and a metal insulator metal capacitor. Agreement of less than 10% is obtained between measurements and simulations. Copyright © 2005 John Wiley & Sons, Ltd.