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A note on the thermal modelling of power semiconductor devices using the network analogue
Author(s) -
Chung Wong Chi
Publication year - 2002
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.443
Subject(s) - transient (computer programming) , thermal , finite element method , boundary value problem , power (physics) , point (geometry) , boundary (topology) , computer science , calculus (dental) , electronic engineering , mechanics , mathematics , electrical engineering , engineering , mathematical analysis , physics , thermodynamics , geometry , medicine , dentistry , operating system
Abstract The aim of this note is to point out that the boundary condition for the network modelling of thermal problems may have been incorrectly used in some previous studies. It is shown that the accuracy of the network analogue or the equivalent finite‐difference method is on the par with the finite‐element method for very fast transient thermal simulations. Copyright © 2002 John Wiley & Sons, Ltd.