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Electrothermal formulation of the partial element equivalent circuit method
Author(s) -
Lombardi Luigi,
Raimondo Raffaele,
Antonini Giulio
Publication year - 2017
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.2253
Subject(s) - partial element equivalent circuit , equivalent circuit , solver , thermal conduction , thermal , network analysis , topology (electrical circuits) , mechanics , electronic engineering , materials science , mathematics , computer science , engineering , mathematical optimization , electrical engineering , physics , thermodynamics , voltage , composite material
This paper presents a combined electrothermal formulation of the partial element equivalent circuit (PEEC) method. It is shown that the distributed thermal problem can be formulated as an equivalent thermal network that shares the same topological and geometrical properties of the PEEC equivalent model. Temperature‐dependent thermal heat conduction and convection models are adopted thus leading to a time‐varying thermal network, which is studied by using pertinent techniques along with the electrical equivalent circuit. The proposed electrothermal PEEC solver is used to analyze 2 problems of interest and verified through comparison with a commercial software.