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High‐frequency modeling of Cu‐graphene heterogeneous interconnects
Author(s) -
Zhao WenSheng,
Zhang Rui,
Fang Yuan,
Yin WenYan,
Wang Gaofeng,
Kang Kai
Publication year - 2015
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.2059
Subject(s) - graphene , interconnection , materials science , sheet resistance , optoelectronics , equivalent circuit , electronic engineering , transmission (telecommunications) , computer science , nanotechnology , electrical engineering , layer (electronics) , telecommunications , engineering , voltage
Summary One novel interconnect scheme consisting of both Cu and graphene sheet is proposed in this paper, with the advantages of both materials exploited greatly. It is shown that the introduction of graphene layers in such heterogeneous interconnect scheme can reduce its effective resistance and thereby improve its transmission performance. On the other hand, it is also demonstrated that both coated and double‐coated structures possess better electrical performance than that of the sandwich one at high frequencies, because the graphene is placed at the interconnect surface where current is crowded. With the help of Partial Element Equivalent Circuit method, together with equivalent circuit technique, the transmission characteristics of some Cu‐graphene interconnects are captured and compared with that of Cu wire, and the advantages of such heterogeneous interconnects can be enlarged with the advanced technology. Copyright © 2015 John Wiley & Sons, Ltd.