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The study of packaging miniaturization effect on the characteristics of an active planar circuit by using the iterative method
Author(s) -
Ziar Toufik,
Zaabat Mourad,
Baudrand Henri
Publication year - 2012
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.1858
Subject(s) - miniaturization , planar , microstrip , matlab , computer science , electronic engineering , iterative method , substrate (aquarium) , electronic circuit , electrical element , electrical impedance , topology (electrical circuits) , electrical engineering , engineering , algorithm , oceanography , computer graphics (images) , geology , operating system
SUMMARY The aim of this manuscript is to present the application of an iterative method based on the concept of transverse wave to analyze the packaging (passive element and substrate) miniaturization effect on the characteristics of an active planar circuit structure. This approach consists in the substitution of the active element by one auxiliary source, and connection is assumed by microstrip line as passive element deposited on one unique substrate. An implementation of the presented theory is shown by extraction of S ‐parameters and impedances of the active circuit using MATLAB program codes. Copyright © 2012 John Wiley & Sons, Ltd.