Premium
Thermal modelling using ASTEC3 software
Author(s) -
Poole N. J.,
Sarvar F.,
Witting P. A.,
McKenzie W. H.
Publication year - 1988
Publication title -
international journal of numerical modelling: electronic networks, devices and fields
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 30
eISSN - 1099-1204
pISSN - 0894-3370
DOI - 10.1002/jnm.1660010206
Subject(s) - thermal conduction , electronic circuit , thermal , software , dissipation , computer science , simple (philosophy) , convection , electronic engineering , thermal radiation , thermal management of electronic devices and systems , software package , simulation software , integrated circuit , mechanical engineering , mechanics , engineering , electrical engineering , physics , thermodynamics , philosophy , epistemology , programming language , operating system
This paper describes the application of ASTEC3, a general purpose analogue electronic circuit simulation package, to the analysis of thermal properties of given structures. The modelling of each system is considered for both conduction and convection mechanisms, radiation being assumed to play a very minor role in heat dissipation from most electrical circuits. A procedure is given for the modelling of one‐, two‐ and three‐dimensional thermal problems which is then used for the simulation of relatively simple examples. The results obtained with ASTEC3 are compared with results determined by using more traditional and independent techniques.