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Copper/Solder intermetallic growth studies
Author(s) -
Kirchner Kevin W.,
Lucey George K.,
Geis James
Publication year - 1993
Publication title -
microscopy research and technique
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.536
H-Index - 118
eISSN - 1097-0029
pISSN - 1059-910X
DOI - 10.1002/jemt.1070250522
Subject(s) - intermetallic , soldering , eutectic system , copper , environmental scanning electron microscope , materials science , metallurgy , diffusion , scanning electron microscope , composite material , thermodynamics , microstructure , alloy , physics
Copper samples, hot solder (eutectic) dipped and thermally aged, were cross‐sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for ∼ 2.5 h at 170°C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real‐time videotape record of the diffusion process and compare the observations to static SEM images reported to represent long‐term, naturally aged intermetallic growth. The video obtained allows the observation of the diffusion process and relativistic growth phenomena at the Cu, Cu 3 Sn, Cu 6 Sn 5 , and solder interfaces as well as effects on the bulk Cu and solder. Effects contrary to earlier reports were observed; for example, growth rates of Cu 3 Sn were found to greatly exceed those of Cu 6 Sn 5 . © 1993 Wiley‐Liss, Inc.