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Preparation of TEM foils from Nb‐10 a/ Si
Author(s) -
Cockeram Brian,
Omlor Ralph E.,
Srinivasan Raghavan,
Weiss Isaac,
Jackson Allen G.
Publication year - 1992
Publication title -
microscopy research and technique
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.536
H-Index - 118
eISSN - 1097-0029
pISSN - 1059-910X
DOI - 10.1002/jemt.1070220307
Subject(s) - electropolishing , foil method , hydrofluoric acid , materials science , nitric acid , microstructure , electrolyte , phase (matter) , alloy , sulfuric acid , grinding , metallurgy , transmission electron microscopy , composite material , nanotechnology , chemistry , organic chemistry , electrode
Ductile phase toughened composites contain phases with significantly different physical properties. Consequently, these phases thin at different rates depending on the sample preparation procedure. A new TEM foil preparation method for the ductile phase toughened Nb‐10 a/o Si material has been developed. The method involves chemical thinning in a 70% nitric acid/ 30% hydrofluoric acid solution followed by electropolishing in a 12.5% sulfuric acid/87.5% methanol electrolyte at −40°C. This procedure for making TEM foils results in large thin areas with the minimum of artifacts. Mechanical grinding of a sample followed by either ion milling, dimpling, or electropolishing produced foils with large electron transparent areas, but with uncharacteristic features of the original Nb‐10 a/o Si alloy microstructure. These artifacts were identified as dislocations, surface mottling, and antiphase domains. © 1992 Wiley‐Liss, Inc.