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Ultrasound evaluation of hepatic and splenic microabscesses in the immunocompromised patient: Sonographic patterns, differential diagnosis, and follow‐up
Author(s) -
Görg C.,
Weide R.,
Schwerk W. B.,
Köppler H.,
Havemann K.
Publication year - 1994
Publication title -
journal of clinical ultrasound
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.272
H-Index - 61
eISSN - 1097-0096
pISSN - 0091-2751
DOI - 10.1002/jcu.1870220902
Subject(s) - medicine , immunosuppression , pathology , chemotherapy , differential diagnosis , lymphoma , spleen , fever of unknown origin , splenic disease , abscess , leukemia , radiology , surgery , splenectomy
Abstract High‐dose chemotherapy, especially for bone marrow transplantation, causes a great degree of immunosuppression, and thus carries the risk for invasive fungal infections. Although hepatic and splenic involvement in disseminated candidiasis is frequent, involvement of these organs is rarely appreciated antemortem. During the last decade, focal hepatosplenic candidiasis has been recognized increasingly by ultrasound. We report the sonographic and clinical findings of 6 patients: 3 AML (acute myeloid leukemia), 2 NHL (non‐Hodgkin's lymphoma), and 1 HD (Hodgkin's disease) who demonstrated multiple, small‐nodule, hypoechoic lesions in spleen and/or liver after high‐dose chemotherapy. All patients were in complete hematologic remission when the study was performed. Septic fever was unresponsive to antibiotic therapy. Granulocy‐topenia (⩽ 1000/mm 3 ) was seen for at least 10 days. However, the manifestation of hepatolienal microabscesses became apparent by ultrasound only after the neutrophil count returned to normal in all but 1 patient. Microabscesses decreased or disappeared on follow‐up examination after antifungal treatment. Systemic candida infection was confirmed serologically. Sonographic‐guided abscess biopsy ( n = 3) revealed necrosis/abscess. Structural inhomogeneity of parenchymal organs was seen for several months after therapy. © 1994 John Wiley & Sons, Inc.