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Development of the powder reaction moulding process
Author(s) -
Zhao Lei,
Collins Maurice N.,
Birkinshaw Colin
Publication year - 2009
Publication title -
journal of chemical technology and biotechnology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.64
H-Index - 117
eISSN - 1097-4660
pISSN - 0268-2575
DOI - 10.1002/jctb.2063
Subject(s) - materials science , injection moulding , sintering , thermogravimetry , ceramic , silicon nitride , composite material , differential scanning calorimetry , porosity , green body , rheology , chemical engineering , layer (electronics) , physics , engineering , thermodynamics
BACKGROUND: The powder reaction moulding process uses a reactive monomer as carrier and binder for the moulding of metal or ceramic powders. De‐binding is achieved using thermal depolymerisation which is followed by sintering to give the finished component. Binder can be recovered for re‐use. RESULTS: Moulding compounds, with various powder volume fractions, have been prepared using stainless steel, silicon nitride and alumina with n‐butyl cyanoacrylate as binder, and the stability of the compounds established. Rheological properties of the compounds have been measured using both pressure flow and drag flow methods. Compounds are strongly pseudoplastic. Comparison of experimental results with theoretical models, describing suspension flow behaviour shows that experimental maximum volume fractions are close to the theoretical volume fraction of 0.42 for silicon nitride, 0.68 for alumina and 0.7 for stainless steel. Differential scanning calorimetry and thermogravimetry have been used to simulate de‐binding and show a rapid loss of binder through depolymerisation. Post‐sintering porosity of the ceramic materials is high but this is thought to arise from the low pressure moulding techniques used. Porosity of the stainless steel mouldings is much lower. CONCLUSIONS: The results validate the powder reaction moulding idea and demonstrate applicability to three widely different powder materials. Copyright © 2008 Society of Chemical Industry