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Enhanced Thermal Stability in SiO 2 /Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application
Author(s) -
Hsieh YaYu,
Huang ChinZen,
Tsai YunChih,
Lin HongPing,
Hsu ChunHan,
Loganathan Aswaghosh
Publication year - 2017
Publication title -
journal of the chinese chemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.329
H-Index - 45
eISSN - 2192-6549
pISSN - 0009-4536
DOI - 10.1002/jccs.201700131
Subject(s) - thermogravimetric analysis , thermal stability , epoxy , composite material , filler (materials) , microwave , husk , thermal conductivity , dynamic mechanical analysis , composite number , materials science , glass transition , chemistry , polymer , organic chemistry , physics , botany , quantum mechanics , biology
Here we report the effect of microwave treatment on a silica–carbon ( SiO 2 /C) filler derived from rice husk and the function of the microwave‐treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO 2 /C filler upon microwave treatment. X‐ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy– SiO 2 /C composite was improved by 178% at 40 wt % content of the microwave‐treated SiO 2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy– SiO 2 /C composites was realized. The improvement in thermal stability of SiO 2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.