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Thermal Properties Improvement of Bismaleimide Resin by a New Phosphorus‐containing Polycyclic Bismaleimide
Author(s) -
Tsai PaiFeng,
Kuo WenLung,
Shau MinDa
Publication year - 2013
Publication title -
journal of the chinese chemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.329
H-Index - 45
eISSN - 2192-6549
pISSN - 0009-4536
DOI - 10.1002/jccs.201200276
Subject(s) - thermogravimetric analysis , differential scanning calorimetry , chemistry , maleic anhydride , phosphorus , char , yield (engineering) , polymer chemistry , elemental analysis , polymer , nuclear chemistry , organic chemistry , composite material , materials science , copolymer , pyrolysis , physics , thermodynamics
Abstract A new phosphorus‐containing polycyclic bismaleimide resin (BMPI) was prepared by the reaction of bis(3‐maleimidophenyl) methylphosphine oxide (BAMP) with benzene‐1,2,4,5‐tetracarboxylic dianhydride (BTD) and maleic anhydride (MA). BMPI was confirmed by infrared (IR), 1 H‐ and 13 C‐NMR spectroscopies. Its thermal properties were carried out by a differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) that revealed that the polymers have excellent thermal properties in the high temperature region and a high char yield of up to 53∼65%. Furthermore, three conventional bismaleimide resins were prepared from different phosphorus‐free bismaleimides for comparison, e.g. 4,4′‐bismaleimidodiphenylmethane (BDM), 4,4′‐bismaleimidodiphenylether (BDE), 4,4′‐bismaleimidodiphenylsulfone (BDS).