Premium
Preparation and Characterization of Epoxy/Inorganic Anti‐electrostatic Nanocomposites Using Submicrometer Al(OH) 3 and Colloid Al 2 O 3
Author(s) -
Chen JungHui,
Liu ShaoTe,
Cheng PaoSwu
Publication year - 2012
Publication title -
journal of the chinese chemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.329
H-Index - 45
eISSN - 2192-6549
pISSN - 0009-4536
DOI - 10.1002/jccs.201100512
Subject(s) - epoxy , nanocomposite , thermal stability , chemistry , colloid , polymer , hybrid material , curing (chemistry) , composite material , pyromellitic dianhydride , chemical engineering , chemical resistance , nanometre , polymer chemistry , materials science , polyimide , organic chemistry , layer (electronics) , engineering
New organic‐inorganic hybrid materials and their anti‐electrostatic hybrid membranes are prepared via sol‐gel process. The polycondensation of epoxy oligomers and AEAPS/Al 2 O 3 complexes which are organically surface modified submicrometer aluminum trihydroxide inorganic fillers with an active aminoterminal silane coupling agent, N‐(2‐aminoethyl)‐3‐aminopropyltrimethoxysilane (AEAPS), are performed. AEAPS enhances the interfacial interactions between the inorganic fillers and epoxy polymers. Meanwhile, this coupling agent maintains well dispersion of fillers in these composites. To improve the mechanical strength and thermal stability, pyromellitic dianhydride (PMDA) is used as curing agent. These hybrid films prepared from this method have excellent physical properties, such as UV‐shielding, high transmission in visible resign (> 85%), high hardness (7∼8H) , high adhesive force (7∼8) and low relative surface resistance (9.71 × 10 11 ∼1.26 × 10 10 Ω/cm 2 ) with anti‐electrostatic characters. For thermal resistance, the best Td value of epoxy/PMDA/AEAPS/Al 2 O 3 is 378.6 °C which is 85.4 °C higher than that of neat epoxy resin. Physical properties of these materials are almost the same as those of the nanocomposites prepared from expensive colloid Al 2 O 3 . Evidences from TEM micrograph show that the inorganic additives are dispersed evenly in organic matrix with nanometer scale.