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The Effect of Temperature, Agitation and Content of Gold on the Thickness of Electroplated Gold at Various Current Densities
Author(s) -
Sheu Fong Chang,
Chen Kuang Shiung
Publication year - 1978
Publication title -
journal of the chinese chemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.329
H-Index - 45
eISSN - 2192-6549
pISSN - 0009-4536
DOI - 10.1002/jccs.197800002
Subject(s) - chemistry , electroplating , diffusion , diffusion layer , diffusion current , current (fluid) , limiting current , limiting , layer (electronics) , ion , current density , analytical chemistry (journal) , thermodynamics , electrode , electrochemistry , chromatography , organic chemistry , mechanical engineering , physics , quantum mechanics , engineering
The effect of temperature, agitation, and content of gold in the solution on the thickness of electroplated gold at various current densities can be easily explained by their effect on the limiting current. Diffusion coefficient of aurocyanide ion, thickness of diffusion layer, and the activity of aurocyanide ion in the bulk solution are the three major factors to affect the limiting current. It was found that the change of temperature will affect both diffusion coefficient and thickness of diffusion layer. However, the thickness of diffusion layer is mainly determined by the means of agitation.