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Development of novel bone‐like nanocomposite coating of hydroxyapatite/collagen on titanium by modified electrophoretic deposition
Author(s) -
IwanamiKadowaki Kaori,
Uchikoshi Tetsuo,
Uezono Masayoshi,
Kikuchi Masanori,
Moriyama Keiji
Publication year - 2021
Publication title -
journal of biomedical materials research part a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.849
H-Index - 150
eISSN - 1552-4965
pISSN - 1549-3296
DOI - 10.1002/jbm.a.37182
Subject(s) - materials science , electrophoretic deposition , coating , nanocomposite , composite material , titanium , adhesive , osseointegration , ceramic , polymer , substrate (aquarium) , chemical engineering , implant , metallurgy , layer (electronics) , medicine , oceanography , surgery , engineering , geology
Electrophoretic deposition (EPD) is a simple, rapid, and inexpensive technique to accomplish uniform coatings with controlled thicknesses. The EPD using binders that do not require a thermal degreasing process, which also eliminates the polymer components of the composite, are required for coating polymer‐ceramic composites. This study demonstrated the application of a modified EPD technique utilizing Mg 2+ ions to coat a bone‐like hydroxyapatite/collagen nanocomposite (HAp/Col) on a titanium (Ti) substrate. The coating thickness was successfully controlled by varying the applied voltage and/or the treatment time. The adhesive strength of the modified EPD coating, evaluated by the tape test, showed class 0 (coating was not peeled off) and drastically increased in comparison to that of the non‐Mg 2+ EPD coating, class 5 (coating was completely peeled off). The MG63 cells on the HAp/Col‐coated Ti demonstrated similar proliferation to and superior alkaline phosphatase activity to that on the bare Ti. Thus, the HAp/Col‐coated Ti is expected to facilitate the surrounding bone formation than the bare‐Ti. The results of the study indicated the HAp/Col‐coated Ti prepared by the modified EPD is effective for applications in novel instruments, such as, subperiosteal temporary anchorage devices, which strongly requires rapid osseointegration at the bone‐implant surface.