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VALIDATION OF TRADE OFF STUDY METHODS APPLICABLE TO PACKAGE‐BASED ENGINEERING
Author(s) -
Botten LeRoy H.
Publication year - 1996
Publication title -
incose international symposium
Language(s) - English
Resource type - Journals
ISSN - 2334-5837
DOI - 10.1002/j.2334-5837.1996.tb02072.x
Subject(s) - systems engineering , computer science , process (computing) , commercial off the shelf , software engineering , manufacturing engineering , industrial engineering , engineering , software , operating system
A mature tradeoff study methodology, developed over the past 25 years, is shown to be consistent with emerging package‐based engineering methods. The tradeoff study methodology and related experiences in implementing complex systems from commercial off‐the‐shelf (COTS) and legacy components are described. Validation of the methodology as a tool for Integrated Process Team use in package‐based engineering is presented.