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P‐96: A De‐bonding Technique with Inorganic Buffer Layer on Flexible Display Panel
Author(s) -
Chen ChienYing,
Chang YuChen,
Lin PoYang,
Ke TsungYing,
Wang PinFang,
Lin YuHsin,
Hwu KehLong,
Chuang ChingSang,
Lin YuHsin
Publication year - 2014
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2014.tb00355.x
Subject(s) - layer (electronics) , fabrication , buffer (optical fiber) , oled , materials science , process (computing) , substrate (aquarium) , optoelectronics , flexible display , flat panel display , nanotechnology , thin film transistor , computer science , telecommunications , operating system , medicine , oceanography , alternative medicine , pathology , geology
In flexible display fabrication, removing the flexible substrate from the rigid carrier glass, without damaging the OLED or the TFT devices, is considered difficult. This particular manufacturing process is referred to as the de‐bonding process. This report provides a simple method to attain a de‐bonding layer which can be applied in a very high temperature process over 450°C. The range of peeling force after the array process can be adapted from 4 to 20 gf.