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P‐92: Encapsulation Adhesive Possessing High Water Barrier and Low Corrosive Properties for Flexible Electronic Device
Author(s) -
Naganawa Satoshi,
Nishijima Kenta,
Hagihara Yoshiaki,
Suzuki Yuta,
Nagamoto Koichi,
Kondo Takeshi
Publication year - 2014
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2014.tb00351.x
Subject(s) - encapsulation (networking) , adhesive , materials science , copper , transmission rate , electrode , electrochemistry , composite material , chemistry , metallurgy , transmission (telecommunications) , electrical engineering , computer network , layer (electronics) , computer science , engineering
An encapsulation material based on a pressure sensitive adhesive (PSA) with a high water barrier and a low corrosive properties is presented. The reproducible water vapor transmission rate is less than 5.0 g·m −2 ·day −1 under 40°C, 90% RH condition. A calcium reaction velocity and an electrochemical migration of a copper electrode were evaluated by direct encapsulation of the test devices. This PSA possesses excellent encapsulation and electric insulation properties. It is expected as one of the most prospective materials as the direct encapsulation adhesive for the flexible electronic device.