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P‐192: Evaluation of Dimensional Stability during Low‐Temperature Poly‐Si TFT Fabrication Process Using an Ultra‐Low Thermal‐Shrinkage Glass Substrate
Author(s) -
Hayashi Kazutaka,
Akiyama Jun,
Kunigita Masaya
Publication year - 2014
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2014.tb00325.x
Subject(s) - shrinkage , fabrication , materials science , thermal stability , substrate (aquarium) , thin film transistor , thermal , glass transition , composite material , polymer , layer (electronics) , chemical engineering , thermodynamics , medicine , oceanography , alternative medicine , physics , pathology , engineering , geology
Dimensional stability of glass substrate is one of the key characteristics for the fabrication of high resolution display using low‐temperature poly‐Si(LTPS) TFT. In this paper, thermal shrinkage behavior of newly developed ultra‐low shrinkage glass substrate during LTPS process was investigated using numerical simulation.