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8.2: Invited Paper : Status and Future Promise of Excimer Laser Annealing for LTPS on Large Glass Substrates
Author(s) -
Sobey Mark,
Schmidt Kai,
Turk Brandon,
Paetzel Rainer
Publication year - 2014
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2014.tb00022.x
Subject(s) - backplane , excimer laser , materials science , annealing (glass) , laser , excimer , optoelectronics , nanotechnology , engineering physics , optics , computer science , engineering , metallurgy , computer hardware , physics
Low‐Temperature Polycrystalline Silicon (LTPS) is the enabling backplane technology for AMOLED displays and small to medium sized high‐resolution AMLCDs. Recently, Excimer Laser Annealing (ELA) equipment has made significant progress in scaling for cost‐effective large‐scale production. In this paper, we discuss the key elements of ELA equipment and the recent and future milestones for LTPS on large substrates.