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6.3: Application of Nanocomposite Materials in the Backplane Technology of Flexible Displays
Author(s) -
Hsieh KunLung,
Hsu TsiHsuan,
Ke TsungYing,
Wang PinFan,
Hwu KehLong
Publication year - 2014
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2014.tb00015.x
Subject(s) - backplane , materials science , nanocomposite , fabrication , thin film transistor , substrate (aquarium) , flexible display , layer (electronics) , silicon , transistor , optoelectronics , nanotechnology , composite material , electrical engineering , engineering , medicine , oceanography , alternative medicine , pathology , voltage , geology
In this paper, we introduced nanocomposite materials as a debonding layer (DBL) in the fabrication of flexible displays. These materials provided flexible substrate with good debonding capability even after 450 o C low‐temperature poly‐silicon (LTPS) process. The effect of temperature on debonding force of flexible substrate was investigated. Besides, some characteristics of thin‐film transistors (TFT) were also studied.