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P.40: Encapsulated Flexible Organic Light‐Emitting Diodes: Progress Toward a Simple and Cost Effective Contact Printing Technique
Author(s) -
Kim Hakkoo,
Song Eun Ho,
Choi Kyung Bok,
Hwang Ju Hyun,
Park Young Wook,
Ju Byeong Kwon
Publication year - 2013
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2013.tb06427.x
Subject(s) - encapsulation (networking) , oled , materials science , reproducibility , electronics , diode , nanotechnology , optoelectronics , organic electronics , process engineering , computer science , chemistry , electrical engineering , transistor , engineering , chromatography , computer network , layer (electronics) , voltage
We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage‐free and rapid process utilizing a UV‐curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.