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70.5L: Late‐News Paper : Low Temperature Curable Cu Ink and Fine Inkjet‐printed Patterning
Author(s) -
Fukuda Miyako,
Ito Masahiro,
Tsuruoka Kaori,
Kuwana Yasuhiro,
Kashiwabara Satoshi,
Hirakoso Hideyuki,
Tagashira Osamu
Publication year - 2013
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2013.tb06246.x
Subject(s) - inkwell , inkjet printing , materials science , curing (chemistry) , nanotechnology , mercury (programming language) , low energy , optoelectronics , composite material , computer science , physics , programming language , atomic physics
Cu wiring patterns of fine pitch less than 20 μm have been successfully achieved by inkjet printing technology with the assistance of surface energy controlled patterns formed by the exposure of ordinary ultrahigh pressure mercury lamp. The curing condition of Cu ink is as mild as 150°C in non‐reducing atmosphere.