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25.2: Invited Paper : ESD and EOS Impacts during Module Assembly Processes for Display Panels
Author(s) -
Chen TungYang,
Ker MingDou
Publication year - 2013
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2013.tb06206.x
Subject(s) - reliability (semiconductor) , electrostatic discharge , process (computing) , production (economics) , root cause , yield (engineering) , liquid crystal display , automotive engineering , manufacturing engineering , computer science , mechanical engineering , process engineering , engineering , reliability engineering , materials science , electrical engineering , composite material , physics , power (physics) , quantum mechanics , voltage , economics , macroeconomics , operating system
In the manufacturing process of the display module assembly, from the integration of PCB and LCD glass to each module to be assembled, there will be a lot of transferred moving and contacted behavior by equipment or personnel, inevitably. Therefore, the ESD and EOS phenomenon occurring in those production processes will impact the reliability of finished or semi‐finished products owing to the damage of ESD/EOS sensitive semiconductor elements. The failure processes and root causes have been addressed to improve the production yield of LCM for display panels.