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P‐54: Contact Printing Technologies for Encapsulation of Flexible OLEDs
Author(s) -
Kim Hakkoo,
Choi Jin Hwan,
Park Young Wook,
Park Tae Hyun,
Song Eun Ho,
Shin Se Joong,
Lee Hyun Jun,
Ju Byeong Kwon
Publication year - 2012
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2012.tb06027.x
Subject(s) - encapsulation (networking) , polydimethylsiloxane , materials science , fabrication , oled , polymer , flexible display , compatibility (geochemistry) , contact print , nanotechnology , composite material , computer science , medicine , computer network , alternative medicine , pathology , layer (electronics) , thin film transistor
Contact printing is an encapsulation technique, which allows printing of UV‐cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light‐emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.