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73.2: A 3D Cover Glass for Mobile Devices
Author(s) -
Panda Prakash C.,
Black Matthew L.,
Cox Judy K.,
Ukrainczyk Ljerka,
Reiman Kevin B.,
Pesansky Jonathan D.,
Glaesemann G. Scott
Publication year - 2012
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2012.tb05958.x
Subject(s) - cover (algebra) , materials science , composite material , stress (linguistics) , thermal , mechanical engineering , engineering , physics , philosophy , linguistics , meteorology
A thermal process has been developed to create 3D cover glass for mobile device applications. After forming, the glass is ion‐exchanged to make a strong, damage‐resistant structure. The response of this glass to stress and damage events is equivalent to that of 2D Corning® Gorilla® Glass.