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20.2: Invited Paper : Reliability Improvement of Flexible AMOLED Based on Auxiliary Functional Film Technology
Author(s) -
Chen Janglin,
Ho JiaChong,
Chen Glory,
Lee ChengChung
Publication year - 2012
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2012.tb05764.x
Subject(s) - amoled , materials science , passivation , thin film transistor , oled , reliability (semiconductor) , polyimide , optoelectronics , amorphous solid , nanotechnology , layer (electronics) , active matrix , chemistry , power (physics) , physics , organic chemistry , quantum mechanics
The flexible universal plane (FlexUP) technology was demonstrated with Polyimide (PI) substrate and a novel de‐bonding method. The transparent amorphous oxide semiconductor (TAOS) TFT, and OLEDs were developed along with the FlexUP technology, aiming to improve the reliability of flexible AMOLED. TAOS TFT successfully improved the bias stress reliability (T 50 ) to approximately over 10 years, and the life time of flexible AMOLED were improved by the new passivation structure and encapsulation materials.