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Modeling copper corrosion in water with low conductivity by using electrochemical techniques
Author(s) -
Hilburn Ronald D.
Publication year - 1983
Publication title -
journal ‐ american water works association
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.466
H-Index - 74
eISSN - 1551-8833
pISSN - 0003-150X
DOI - 10.1002/j.1551-8833.1983.tb05091.x
Subject(s) - corrosion , copper , electrochemistry , diffusion , conductivity , oxide , materials science , inorganic chemistry , reaction rate , chemistry , metallurgy , chemical engineering , electrode , thermodynamics , organic chemistry , physics , catalysis , engineering
Corrosion rates of copper in synthetic water were measured by using an electrochemical method whose results were verified by coupon tests. The synthetic water was prepared to simulate the concentrations of the principal inorganic anions and cations found in a drinking water supply. Control of the corrosion rate by either chemical reaction, diffusion of reactive species through the oxide film, or diffusion of reactive species through the solution was considered. Experimental conditions included various combinations of temperature (5° C, 15° C, or 25° C) and pH (6.0‐8.3). In general, the corrosion rate decreased with an increase in pH and a decrease in temperature, although the rate varied with the type of control.